Tuesday, October 18

Check-in/Breakfast  Room: Mezzanine/Salon A

State of the Center - Dr. Kiruba Haran  Room: Salon EF

Industry Project Updates - 15 min pres + 5 min Q&A  Room: Salon EF

• I1.018.21-Optimal Spatial Packaging - Dr. Allison
• I2.019.21-Enablement of Modules via Direct Cooling - Dr. Huitink
• I1.021.22-Battery Pack Power-Thermal Co-Management - Dr. Wang
• I1.022.22-Virtual Testbed for Fast Charging Systems - Dr. Miljkovic
• I2.020.22-Data Driven Reliability Monitoring - Dr. Senesky

Poster Session #1  Room: Mezzanine

1. I1.018.21-Optimal 3D Spatial Packaging of Interconnected Systems with Physics Interactions (3D-SPI2)
2. I1.020.21-Motor Winding Reliability Model
3. I1.021.22-Battery Pack Power-Thermal Co-Management System Design Optimization for Enhanced Reliability and Safety Performances
4. I1.022.22-Virtual Testbed for Fast Charging Battery Systems
5. I2.019.21-Enablement of High-Voltage, High-Power Modules via Performance and Durability Validation of Direct Cooling, Voltage Blocking Technologies
6. I2.020.22-Mathematic Modeling of Battery Thermal Runaway
7. I3.021.21-Battery Pack Power-Thermal Co-Management System Design Optimization for Enhanced Reliability and Safety Performances
8. REU - Manifold Geometric Optimization for Flow Cooling of Electronics with Monolithically Integrated Copper Heat Spreaders 
9. R1.013.20-Design and Control Optimization of Complex, Multi-Domain Systems-of-Systems for Improved Power Density
10. R2.033.20-Design of a High Temperature Integrated SiC Power Module with Optical Galvanic Isolation
11. R3.030.20-Phase change material integration for power electronic device reliability
12. R3.040.22-3D Printing of Aligned Single-Walled Carbon Nanotube (SWCNT) Films with Improved Thermal, Electrical, and Mechanical Properties​

Materials Workshop - Dr. Smith Room: Salon EF

Materials selection and development has been at the heart of POETS efforts since the start of the center; however, they take a significant amount of time to assess, develop, and mature. This session will explore the development and integration of new materials and materials systems for electro-thermal power density improvements

• Materials enabling higher heat fluxes for components with the goal of improved thermal management (Dr. Asheghi)
• Novel materials and approaches for high power and energy density thermal energy storage (Dr. Miljkovic)
• Nitride materials in power electronics (Dr. Stillwell)
• Cryogenics for conventional systems and for superconductivity (Dr. Haran, Dr. Mantooth)

Agenda:

• 90 min: (20 min overview on each bulleted topic above + Q&A)
• 30 min: Guided discussion on challenges and needs regarding materials and how POETS can contribute. Group will rank and stack ideas to ensure POETS is focusing on highest need objectives

Poster Session #2  Room: Mezzanine

1. R1.014.20-System level performance impacts of component and device level improvements
2. R2.034.20-Heterogeneous SiC Power Modules with Active Cooling
3. R3.032.20-Development of Copper Nanowires (CuNWs) Thermal Interface Materials (TIMs) with (Cu, Ni)–Sn, Transient Liquid Phase (TLP) Bonding, for High-Temperature Power Electronics Applications
4. R1.015.20-Extension of POETS Packing and Routing Methods to Industry-Relevant 3D Electro-thermal Problems
5. R2.035.20-Enabling Hi-Temp Capable, EMI Shielding & Responsible Custom Addistive thermal Management for Hi-V Switching Electronics
6. R3.041.22-Packaged high-temperature AlN capacitors
7. REU-Characterization of Flowing Dielectric Fluids for Cooling High Voltage Power Modules
8. R1.016.20-Combined Electromigration and Mechanical Failure Risk in Interconnects: The Imminent Threat to Power Package Reliability
9. R2.037.22-Converter-Integrated Variable-Pole Induction Machine Drive for Heavy-Duty Vehicles
10. R3.035.20-High-speed GaN Triple Lateral-JFET Current Limiter
11. R2.044.22-Thermal Modeling & Optimization of Wide Band Gap Transistors, Packaging, and Cooling Solutions for Power Electronics
12. R1.018.20-A Multidisciplinary Design Optimization Framework for Efficient Design of eVTOLs

Faculty/Staff/Guests - Explore San Jose!  *optional Open time for all participants to make their way through San Jose for dinner or just exploring.

San Jose Website: Restaurants, Nightlife, Things to Do

Wednesday, October 19

Research Track

Education Track

Technology Roadmapping- POETS Year 1 through 7  Room: Salons EF

Summary of Session

15 min: >10x Improvement of Power Density of Electric Systems - (Dr. Haran)

25 min: Materials and Devices (Dr. Miljkovic)

• Electrical/thermal conductivity
• Advanced passives
• High temp
• High-density thermal energy storage

25 min: Components and Subsystems (Dr. Huitink)

• Electric machines
• Fabrication methods
• Power electronics

15 min: Systems and Testbeds (Dr. Mantooth)

• Packaging
  • Spatial optimization
  • Power module layout
• Integrated sensing
• Integrated cooling
• Testbeds

SLC Town Hall  Room: Salon H

60 min: Icebreaker session

60 min: Outreach

60 min: Townhall discussion about SLC and student brainstorming

Poster Session #3  Location: Mezzanine

1. R1.020.22-PowerSynth 3D: Extending Design Automation from Modules to Converters
2. R2.038.22-Microcooler Electro-Thermal Integration on GaN Devices Enables Ultra-High Power Density Converters with Robust Indirect Embedded Cooling
3. R3.036.20-Benchmarking of Deployment-ready GaN Sensor and Amplification Electronics
4. REU-Thermal PID Controller for Air Taxi EVTOL Reliability Testing
5. R1.021.22-Integrated Thermal Management System (TMS) Design and Spatial Packaging Optimization for Battery Electric Vehicles (BEVs)
6. R2.039.22-Design of A fast-switching SiC power module for high-temperature applications
7. R3.037.22-High Temperature Solid State Batteries
8. R1.017.20-Cold Plate Designer: A Software Tool to Rapidly Design High-Performance Lightweight Cold Plates with Heterogeneous Cooling Capability
9. R2.040.22-Multi-fidelity Modeling and Sensor Data Fusion for Partial Discharge Diagnosis and Reliability Assessment
10. R3.038.22-Replacing the Solder Ball Technology: Development of a Compliant Electrical (EIMs) and Thermal Interface Materials (TIMs) Interconnects using Copper Nano-wires (CuNWs)
11. R2.041.22-High Power Density 6-in-1 SiC Power Module with Integrated Double-sided Micro-channel Cooling
12. R2.031.20-Testbed Integration of Lithium-Ion Battery Packs with Novel Thermal Management Systems

Lunch - Closed Sessions

• Industry closed session (Owen Doyle)  Room: Monterey Room 
• Student closed session (Dr. Krein)  Room: Salon H
• Faculty Closed session (Dr. Haran)  Location: Salon A

Technology Roadmapping - POETS Year 8 and Beyond  Room: Salons EF 

30 min: Moving forward on the below topics

• >10x Improvement of Power Density of Electrified Systems
• Materials and Devises
• Components and Subsystems
• Systems and Testbeds

30 min: Wrap-up - Topics to continue, topics to sunset

Enjoy San Francisco's Fisherman's Wharf! *optional

Meet in the lobby of the hotel

Arrive in San Francisco at Pier 39

Load bus at Pier 39 location for transport back to San Jose