Current Projects
|
PI and Collaborators |
Project # | Project Title | |
|---|---|---|---|
|
Stillwell (UI), Haran (UI) |
R1.019.22 | Investigating Optimal Inverter Topologies for High-Frequency Low-Inductance Motors | |
| Mantooth (UA), Peng (UA), Stillwell (UI) | R1.020.22 | PowerSynth 3D: Extending Design Automation from Modules to Converters | |
| Allison (UI), James (UI), Miljkovic (UI) |
R1.021.22 |
Integrated Thermal Management System (TMS) Design and Spatial Packaging Optimization for Battery Electric Vehicles (BEVs) | |
| Miljkovic (UI), Asheghi (SU), Goodson (SU), Huitink (UA) | R1.022.23 | Development of a Virtual Electrical-Thermal System Design and Optimizer Platform | |
| Banerjee (UI), Miljkovic (UI) | R2.037.22 | Converter-Integrated Variable-Pole Induction Machine Drive for Heavy-Duty Vehicles | |
| Miljkovic (UI), Goodson (SU), Smith (HU), Zhao (UA) | R2.038.22 | Microcooler Electro-Thermal Integration on GaN Devices Enables Ultra-High Power Density Converters with Robust Indirect Embedded Cooling | |
| Wang (UI), Haran (UI), Senesky (SU) | R2.040.22 | Multi-fidelity Modeling and Sensor Data Fusion for Partial Discharge Diagnosis and Reliability Assessment | |
| Mantooth (UA), Asheghi (SU), Goodson (SU) | R2.041.22 | High Power Density 6-in-1 SiC Power Module with Integrated Double-sided Micro-channel Cooling | |
| Smith (HU), Braun (UI) | R2.042.22 | Design of Enhanced PCMs Materials for Embedded Battery Thermal Management | |
| Goodson (SU), Asheghi (SU), Mantooth (UA) | R2.045.23 | Development of a Breakthrough Thermal Management System Concept for Power Electronic Modules | |
| Braun (UI), Smith (HU) | R3.037.22 | High Temperature Solid State Batteries | |
| King (UI), Mantooth (UA), Miljkovic (UI) | R3.039.22 | Phase Change Material Module Development and Testbed Integration to Demonstrate Increased Power Density of Aircraft Electro-Thermal Systems | |
| Lyding (UI), Braun (UI), Huitink (UA) | R3.040.22 | 3D Printed Carbon Nanotube Applications | |
| Huitink (UA) | R3.042.23 | Seed investigation of encapsulated PCM as a means to thermally active packaging materials | |
| Clarke (UI) | R1.023.23 | Investigating the Thermal Management Requirements for Nominal and Failure-Made Flight Conditions | |
Updated 02022024