Center for Power Optimization of Electro-thermal Systems

Publications

Thrust Year Title Authors
  2021 Accelerated Mechanical Low Cycle Fatigue in Isothermal Solder Interconnects Marbut, C., Nafis, B., & Huitink, D. 
  2020 A Novel Two-Stage Design Framework for 2D Spatial Package of Interconnected Components Peddada, S., James, K., & Allison, J. 
  2020 Plant and Controller Optimization for Power and Energy Systems with Model Predictive Control Docimo, D., Kang, Z., James, K., & Alleyne, A.
  2020 Hybrid Duty Modulation for Dual Active Bridge Converter to Minimize RMS Current and Extend Soft-Switching Range Using Frequency Domain Analysis Mou, D., Luo, Q., Li, J., Wei, Y., Wang, Z., Sun, P., Du., X. & Mantooth, H.A.
  2020 Quantifying Dynamic On-State Resistance of GaN HEMTS for Power Converter Design via a Survey of Low and High Voltage Devices Foulkes, T., Modeer, T., & Pilawa-Podgurski, R.
  2020 Maintenance Decision Making using State Dependent Markov Analysis with Failure Couplings Liu, X., & Wang, P.
  2020 Considerations and Challenges for Large Area Embedded Micro-channels with 3D Manifold in High Heat Flux Power Electronic Applications Piazza, A., Hazra, S., Jung, K.W., Degner, M., Man, P., Jih, E., Asheghi, M., & Goodson, K.
  2020 Risk-Averse Optimization for Resilience Enhancement of Complex Engineering Systems under Uncertainties Wu, X., & Wang, P. 
  2020 Low Offset and Noise in High Biased GaN 2DEG Hall-Effect Plates Investigated with Infrared Microscopy Dowling, K., Liu, T., Alpert, H., Chapin, C., Eisner, S., Yalamarthy, A., Satterthwaite, P., Kock, H., Ausserlechner, U., Asheghi, M., Goodson, K., & Senesky, D
  2020 Thermal and Electrical Performance in High-Voltage Power Modules with Nonmetallic Additively Manufactured Impingement Coolers Whitt, R., Huitink, D., Emon, A., Deshpande, A., & Luo, F. 
  2020 Monolithic Heterogeneous Integration of 3D Radio Frequency L-C Elements by Self-Rolled-Up Membrane Nanotechnology Yang, Z., Kraman, M., Zheng, Z., Zhao, H., Zhang, J., Gong, S., Shao, Y.V., Huang, W., Wang, P., and Li, X. 
  2020 Electronic Design Automation (EDA) Tools and Considerations for Electro-Thermo-Mechanical Co-Design of High Voltage Power Modules Evans, T., Mukherjee, S., Peng, Y., and Mantooth, H.A.
  2020 Hierarchical Hybrid MPC for Management of Distributed Phase Change Thermal Entergy Storage Pangborn, H., Laird, C., & Alleyne, A.
  2020 Experimental Model and Controller Validation for a Series Hybrid Unmanned Aerial Vehicle Aksland, C. & Alleyne, A. 
Thrust 1 2019 Graph-Based Electro-Mechanical Modeling of a Hybrid Unmanned Aerial Vehicle for Real-Time Applications* Research supported by the National Science Foundation Engineering Research Center for Power Optimization of Electro-Thermal Systems (POETS) with cooperative agreement EEC-1449548. Aksland, C. T., Bixel, T. W., Raymond, L. C., Rottmayer, M. A., & Alleyne, A. G.
Thrust 1 2018 Power Density as the Key Enabler for Electrified Mobility. Alleyne, A.
Thrust 1 2019 A Comparative Study of Formulations and Algorithms for Reliability-Based Co-Design Problems. Cui, T., Allison, J. T., & Wang, P.
Thrust 1 2020 "Reliability-based Co-Design of State-Constrained Stochastic Dynamical Systems." Cui, T., Allison, J. T., & Wang, P.
Thrust 1 2019 Design of a High Efficiency, High Specific-Power Three-level T-type Power Electronics Building Block for Aircraft Electric-Propulsion Drives. Deshpande, A., Chen, Y., Narayanasamy, B., Yuan, Z., Chen, C., & Luo, F.
Thrust 1 2020 "A Novel Framework for Simultaneous Topology and Sizing Optimization of Complex Multi-Domain Systems-of-Systems.” Docimo, D. J., Kang, Z., James, K. A., & Alleyne, A. G.
Thrust 1 2018 PowerSynth: A Power Module Layout Generation Tool. Evans, T. M., Le, Q., Mukherjee, S., Razi, I. A., Vrotsos, T., Peng, Y., & Mantooth, A. H.
Thrust 1 2020 " Architecture Generation and Performance Evaluation of Aircraft Thermal Management Systems Through Graph-based Techniques." Herber, D. R., Allison, J. T., Buettner, R., Abolmoali, P., & Patnaik, S. S.
Thrust 1 2019 Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa. Jung, K. W., Lee, H., Kharangate, C., Zhou, F., Asheghi, M., Dede, E. M., & Goodson, K. E.
Thrust 1 2019 Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm2) Power Electronics Cooling. Jung, K. W., Hazra, S., Kwon, H., Piazza, A., Jih, E., Asheghi, M., … Goodson, K. E.
Thrust 1 2016 Combining Self-Optimizing Control and Extremum Seeking for Online Optimization with Application to Vapor Compression Cycles. Keating, B. D., & Alleyne, A.
Thrust 1 2018 Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop. Kharangate, C. R., Jung, K. W., Jung, S., Kong, D., Schaadt, J., Iyengar, M., . . . Goodson, K. E.
Thrust 1 2017 Stability of decentralized model predictive control of graph-based power flow systems via passivity. Koeln, J. P., & Alleyne, A. G.
Thrust 1 2019 Hierarchical Control of Aircraft Electro-Thermal Systems. Koeln, J. P., Pangborn, H. C., Williams, M. A., Kawamura, M. L., & Alleyne, A. G.
Thrust 1 2018 Robust hierarchical model predictive control of graph-based power flow systems. Koeln, J. P., & Alleyne, A. G.
Thrust 1 2016 A Physics-Based Compact Model for GaN HEMT Power Devices. Kotecha, R. M., Zhang, Y., Rashid, A., Vrotsos, T., & Mantooth, H. A.
Thrust 1 2019 A Hybrid Electro-Thermal Energy Storage System for High Ramp Rate Power Applications. Laird, C. E., & Alleyne, A. G.
Thrust 1 2019 PEEC Method and Hierarchical Approach Towards 3D Multichip Power Module (MCPM) Layout Optimization. Le, Q., Evans, T., Peng, Y., & Mantooth, H. A.
Thrust 1 2016 Fast Transient Thermal and Power Dissipation Modeling for Multi-Chip Power Modules: A Preliminary Assessment of Different Electro-Thermal Evaluation Methods. Le, Q., Mukherjee, S., Vrotsos, T., & Mantooth, H. A.
Thrust 1 2019 Tunable, passive thermal regulation through liquid to vapor phase change. Liu, T., Palko, J. W., Katz, J. S., Dede, E. M., Zhou, F., Asheghi, M., & Goodson, K. E.
Thrust 1 2019 A study on practical objectives and constraints for heat conduction topology optimization. Lohan, D. J., Dede, E. M., & Allison, J. T.
Thrust 1 2016 Topology Optimization Formulations for Circuit Board Heat Spreader Design. Lohan, D. J., Dede, E., & Allison, J.
Thrust 1 2019 Cooperativity and Hierarchical MPC of State-Constrained Switched Power Flow Systems. Pangborn, H. C., & Alleyne, A. G.
Thrust 1 2016 Switched Linear Control for Refrigerant Superheat Recovery in Vapor Compression Systems. Control Engineering Practice, 57, 142-156. Pangborn, H. C., & Alleyne, A. G.
Thrust 1 2017 Hardware-in-the-Loop Validation of Advanced Fuel Thermal Management Control. Pangborn, H. C., Hey, J. E., Deppen, T. O., Alleyne, A. G., & Fisher, T. S.
Thrust 1 2018 Experimental Validation of Graph-Based Hierarchical Control for Thermal Management. Pangborn, H. C., Koeln, J. P., Williams, M. A., & Alleyne, A. G.
Thrust 1 2016 Switched Linear Control of Vapor Compression Systems under Highly Transient Conditions. Pangborn, H., & Alleyne, A. G.
Thrust 1 2019 Optimal Sensor Placement Methods in Active High Power Density Electronic Systems with Experimental Validation. Peddada, S. R. T., Tannous, P. J., Alleyne, A. G., & Allison, J. T.
Thrust 1 2019 Optimal Flow Control and Single Split Architecture Exploration for Fluid-Based Thermal Management. Peddada, S. R. T., Herber, D. R., Pangborn, H. C., Alleyne, A. G., & Allison, J. T.
Thrust 1 2019 Hierarchical Layout Synthesis and Design Automation for 2.5D Heterogeneous Multi-Chip Power Modules. Razi, I. A., Le, Q., Mantooth, H. A., & Peng, Y.
Thrust 1 2016 Model Predictive Control of Temperature-Sensitive and Transient Loads in Aircraft Vapor Compression System. Pollock, D. T., Williams, M. A., & Hencey, B. M.
Thrust 1 2019 Hierarchical Estimation for Complex Multi-Domain Dynamical Systems. Tannous, P. J., Docimo, D. J., Pangborn, H. C., & Alleyne, A. G.
Thrust 1 2019 Model-based temperature estimation of power electronics systems. Tannous, P. J., Peddada, S. R., Allison, J. T., Foulkes, T., Pilawa-Podgurski, R. C., & Alleyne, A. G.
Thrust 1 2016 Hybrid Model Predictive Control of Multi-Compressor Vapor Compression Systems. Williams, M. A., Alleyne, A. G., & Hencey, B. M.
Thrust 1 2017 Dynamical Graph Models of Aircraft Electrical, Thermal, and Turbomachinery Components. Williams, M. A., Koeln, J. P., Pangborn, H. C., & Alleyne, A. G.
Thrust 2 2017 Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper Agonafer, Damena, Mehdi Asheghi, Kenneth E. Goodson, Ki Wook Jung, James Palko, Chi Zhang, David Altman, Juan Santiago, Hyoungsoon Lee, & Yoonjin Won
Thrust 2 2019 A Compact 50-kW Traction Inverter Design Using Off-the-Shelf Components. Alizadeh, R., Adamson, T., Balda, J. C., Zhao, Y., Asheghi, M., & Goodson, K. E.
Thrust 2 2019 A Minimum DC-Link Capacitance Estimation and Robust Voltage Control for an N-Phase Interleaved Boost Converter Supplying a Traction Inverter.  Alizadeh, R., Jorge, S. G., Balda, J. C., & Zhao, Y.
Thrust 2 2016 Design and Control of a GaN-based, 13-level, Flying Capacitor Multilevel Inverter. Barth, C. B., Foulkes, T., Chung, W. H., Modeer, T., Assem, P., Assem, P., . . . Pilawa-Podgurski, R. C.
Thrust 2 2019 Numerical Simulation of Jumping Droplet Condensation.  Birbarah, P., Chavan, S., & Miljkovic, N.
Thrust 2 2020 Water immersion cooling of high power density electronics.  Birbarah, P., Gebrael, T., Foulkes, T., Stillwell, A., Moore, A., Pilawa-Podgurski, R., & Miljkovic, N.
Thrust 2 2016 Power Electronics Implementation of Dynamic Thermal Inertia to Offset Stochastic Solar Resources in Low-Energy Buildings.  Cao, Y., Magerko, J. A., Navidi, T., & Krein, P. T.
Thrust 2 2019 An Interleaved 6-Level GaN Bidirectional Converter for Level II Electric Vehicle Charging. Chou, D., Fernandez, K., & Pilawa-Podgurski, R. C. N.
Thrust 2 2019 Stacked DBC Cavitied Substrate for a 15-kV Half-bridge Power Module. Deshpande, A., Luo, F., Iradukunda, A., Huitink, D., & Boteler, L.
Thrust 2 2019 Cold plate cooling simulation for Lithium-ion semi-passive battery thermal management system.  Gresham-Chisolm, D., & Smith, S. T.
Thrust 2 2017 Mechanical Design Considerations of an “Ironless,” High-Specific-Power Electric Machine Haran, Kiruba, Yuanshan Chen, Reed Sanchez, & Andy Yoon
Thrust 2 2019 Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal. Hazra, S., Jung, K. W., Iyengar, M., Malone, C., Asheghi, M., & Goodson, K. E.
Thrust 2 2019 Visualization of Droplet Nucleation on Patterned Hybrid Surfaces.  Hoque, M. J., Keum, H., Kim, S., & Miljkovic, N.
Thrust 2 2016 Impact of Nano-Diamond Composites on Low-Temperature Co-Fired Ceramic Interposer for Wide Bandgap Power Electronic Module Packages.  Huang, S., Xu, Z., Yu, F., & Ang, S. S.
Thrust 2 2019 Topology Optimized Fins for a PCM-Based Thermal Management System.  Iradukunda, A.-C., & Huitink, D.
Thrust 2 2016 The Peculiarities of Strain Relaxation in GaN/AlN Superlattices Grown on Vicinal GaN (0001) Substrate: Comparative XRD and AFM Study. Kuchuk, A. V., Kryvyi, S., Lytvyn, P. M., Li, S., Kladko, V. P., Ware, M. E., . . . Salamo, G. J.
Thrust 2 2019 Additively Manufactured Impinging Air Jet Cooler for High-Power Electronic Devices.  Kwon, B., Foulkes, T., Yang, T., Miljkovic, N., & King, W. P.
Thrust 2 2017 A 2-kW Single-Phase Seven-Level Flying Capacitor Multilevel Inverter With an Active Energy Buffer. Lei, Y., Barth, C., Qin, S., Liu, W., Moon, I., Stillwell, A., . . . Pilawa-Podgurski, R. C.
Thrust 2 2019 Material Properties Analysis of Circuit Subassemblies: Quantitative Characterizaiton of Sapphire (alpha-Al203) and Silicon Nitride (Si3N4) Using Cryogenic Cycling. Lovelace, K. A., & Smith, S. T.
Thrust 2 2019 Quantitative Characterization of Sapphire and Silicon Nitride for Space Applications Circuit Subassemblies Using Cryogenic Cycling.  Lovelace, K., & Smith, S.
Thrust 2 2018 Rapid Solder Interconnect Fatigue Life Test Methodology for Predicting Thermomechanical Reliability.  Marbut, C. J., Montazeri, M., & Huitink, D. R.
Thrust 2 2019 In Situ Resistance Monitoring and Fatigue Life Prediction for Flip-Chip Solder Interconnects Using RAPID Mechanical Cycling Method.  Marbut, C., Montazeri, M., & Huitink, D.
Thrust 2 2016 An Analytical Method for Evaluating the Power Density of Multilevel Converters.  Modeer, T., Barth, C., Lei, Y., & Pilawa-Podgurski, R.
Thrust 2 2019 Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test.  Montazeri, M., Marbut, C. J., & Huitink, D.
Thrust 2 2019 Understanding the switching mechanism of interfacial phase change memory.  Okabe, K. L., Sood, A., Yalon, E., Neumann, C. M., Asheghi, M., Pop, E., … Wong, H.-S. P.
Thrust 2 2019 Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis.  Pense, D., Carlton, H., & Huitink, D.
Thrust 2 2017 Effect of well/barrier thickness ratio on strain relaxation in GaN/AlN superlattices grown on GaN/sapphire template, Salamo, Greg J.
Thrust 2 2018 Asymmetrical reciprocal space mapping using X-ray diffraction: a technique for structural characterization of GaN/AlN superlattices, Salamo, Greg J.
Thrust 2 2018 Optical and structural study of deformation states in the GaN/AlN superlattices, Salamo, Greg J.
Thrust 2 2019 Process-induced anomalous current transport in graphene/InAlN/GaN heterostructured diodes.  Satterthwaite, P. F., Yalamarthy, A. S., Vaziri, S., Rojo, M. M., Pop, E., & Senesky, D. G.
Thrust 2 2016 The Design and Evaluation of an Integrated Wire Bond-less Power Module using a Low Temperature Co-fired Ceramic Interposer. Seal, S., Glover, M. D., & Mantooth, H. A.
Thrust 2 2016 Flip-Chip Bonded Silicon Carbide MOSFETs as a Low Parasitic Alternative to Wire-Bonding.  Seal, S., Glover, M. D., Wallace, A. K., & Mantooth, H. A.
Thrust 2 2016 X-ray Reciprocal Space Mapping of Graded Al x Ga1 − x N Films and Nanowires. Stanchu, H. V., Kuchuk, A. V., Kladko, V. P., Ware, M. E., Mazur, Y. I., Zytkiewicz, Z. R., . . . Salamo, G. J.
Thrust 2 2016 DC characteristics of ALD-grown Al 2 O 3 /AlGaN/GaN MIS-HEMTs and HEMTs at 600 °C in air. Suria, A. J., Yalamarthy, A. S., So, H., & Senesky, D. G.
Thrust 2 2019 Analysis of heater-wall temperature distributions during the saturated pool boiling of water.  Voglar, J., Zupančič, M., Peperko, A., Birbarah, P., Miljkovic, N., & Golobič, I.
Thrust 2 2016 Water Droplet Impact on Elastic Superhydrophobic Surfaces.  Weisensee, P. B., Tian, J., Miljkovic, N., & King, W. P.
Thrust 2 2017 Springboard Droplet Bouncing on Flexible Superhydrophobic Substrates. Weisensee, P. B., Tian, J., Miljkovic, N., & King, W. P.
Thrust 2 2019 Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics.  Whitt, R., Nafis, B., Huitink, D., Yuan, Z., Deshpande, A., Narayanasamy, B., & Luo, F.
Thrust 2 2019 Thermal Validations Of Additive Manufactured Non-Metallic Heat Spreading Device For Hot Spot Mitigation In Power Modules.  Whitt, R., & Huitink, D.
Thrust 2 2018 Millimeter-scale liquid metal droplet thermal switch.  Yang, T., Kwon, B., Weisensee, P. B., Kang, J. G., Li, X., Braun, P., . . . King, W. P.
Thrust 2 2019 An Integrated Liquid Metal Thermal Switch for Active Thermal Management of Electronics.  Yang, T., Foulkes, T., Kwon, B., Kang, J. G., Braun, P. V., King, W. P., & Miljkovic, N.
Thrust 2 2019 Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application. Yuan, Z., Deshpande, A., Narayanasamy, B., Peng, H., Emon, A. I., Whitt, R., … Huitink, D.
Thrust 2 2018 Enhanced Capillary-Fed Boiling in Copper Inverse Opals via Template Sintering.  Zhang, C., Palko, J. W., Barako, M. T., Asheghi, M., Santiago, J. G., & Goodson, K. E.
Thrust 2 2018 Tailoring Permeability of Microporous Copper Structures through Template Sintering.  ​Zhang, C., Palko, J. W., Rong, G., Pringle, K. S., Barako, M. T., Dusseault, T. J., . . . Goodson, K. E.
Thrust 2 2019 Lithiation Induced Stress Concentration for 3D Metal Scaffold Structured Silicon Anodes. Zheng, Z., Chen, B., Fritz, N., Gurumukhi, Y., Cook, J., Ates, M. N., … Wang, P.
Thrust 3 2017 Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper Agonafer, Damena, Mehdi Asheghi, Kenneth E. Goodson, Ki Wook Jung, James Palko, Chi Zhang, David Altman, Juan Santiago, Hyoungsoon Lee, & Yoonjin Won
Thrust 3 2019 A Compact 50-kW Traction Inverter Design Using Off-the-Shelf Components. Alizadeh, R., Adamson, T., Balda, J. C., Zhao, Y., Asheghi, M., & Goodson, K. E.
Thrust 3 2019 A Minimum DC-Link Capacitance Estimation and Robust Voltage Control for an N-Phase Interleaved Boost Converter Supplying a Traction Inverter.  Alizadeh, R., Jorge, S. G., Balda, J. C., & Zhao, Y.
Thrust 3 2016 Design and Control of a GaN-based, 13-level, Flying Capacitor Multilevel Inverter. Barth, C. B., Foulkes, T., Chung, W. H., Modeer, T., Assem, P., Assem, P., . . . Pilawa-Podgurski, R. C.
Thrust 3 2019 Numerical Simulation of Jumping Droplet Condensation.  Birbarah, P., Chavan, S., & Miljkovic, N.
Thrust 3 2020 Water immersion cooling of high power density electronics.  Birbarah, P., Gebrael, T., Foulkes, T., Stillwell, A., Moore, A., Pilawa-Podgurski, R., & Miljkovic, N.
Thrust 3 2016 Power Electronics Implementation of Dynamic Thermal Inertia to Offset Stochastic Solar Resources in Low-Energy Buildings.  Cao, Y., Magerko, J. A., Navidi, T., & Krein, P. T.
Thrust 3 2019 An Interleaved 6-Level GaN Bidirectional Converter for Level II Electric Vehicle Charging. Chou, D., Fernandez, K., & Pilawa-Podgurski, R. C. N.
Thrust 3 2019 Stacked DBC Cavitied Substrate for a 15-kV Half-bridge Power Module. Deshpande, A., Luo, F., Iradukunda, A., Huitink, D., & Boteler, L.
Thrust 3 2019 Cold plate cooling simulation for Lithium-ion semi-passive battery thermal management system.  Gresham-Chisolm, D., & Smith, S. T.
Thrust 3 2017 Mechanical Design Considerations of an “Ironless,” High-Specific-Power Electric Machine Haran, Kiruba, Yuanshan Chen, Reed Sanchez, & Andy Yoon
Thrust 3 2019 Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal. Hazra, S., Jung, K. W., Iyengar, M., Malone, C., Asheghi, M., & Goodson, K. E.
Thrust 3 2019 Visualization of Droplet Nucleation on Patterned Hybrid Surfaces.  Hoque, M. J., Keum, H., Kim, S., & Miljkovic, N.
Thrust 3 2016 Impact of Nano-Diamond Composites on Low-Temperature Co-Fired Ceramic Interposer for Wide Bandgap Power Electronic Module Packages.  Huang, S., Xu, Z., Yu, F., & Ang, S. S.
Thrust 3 2019 Topology Optimized Fins for a PCM-Based Thermal Management System.  Iradukunda, A.-C., & Huitink, D.
Thrust 3 2016 The Peculiarities of Strain Relaxation in GaN/AlN Superlattices Grown on Vicinal GaN (0001) Substrate: Comparative XRD and AFM Study. Kuchuk, A. V., Kryvyi, S., Lytvyn, P. M., Li, S., Kladko, V. P., Ware, M. E., . . . Salamo, G. J.
Thrust 3 2019 Additively Manufactured Impinging Air Jet Cooler for High-Power Electronic Devices.  Kwon, B., Foulkes, T., Yang, T., Miljkovic, N., & King, W. P.
Thrust 3 2017 A 2-kW Single-Phase Seven-Level Flying Capacitor Multilevel Inverter With an Active Energy Buffer. Lei, Y., Barth, C., Qin, S., Liu, W., Moon, I., Stillwell, A., . . . Pilawa-Podgurski, R. C.
Thrust 3 2019 Material Properties Analysis of Circuit Subassemblies: Quantitative Characterizaiton of Sapphire (alpha-Al203) and Silicon Nitride (Si3N4) Using Cryogenic Cycling. Lovelace, K. A., & Smith, S. T.
Thrust 3 2019 Quantitative Characterization of Sapphire and Silicon Nitride for Space Applications Circuit Subassemblies Using Cryogenic Cycling.  Lovelace, K., & Smith, S.
Thrust 3 2018 Rapid Solder Interconnect Fatigue Life Test Methodology for Predicting Thermomechanical Reliability.  Marbut, C. J., Montazeri, M., & Huitink, D. R.
Thrust 3 2019 In Situ Resistance Monitoring and Fatigue Life Prediction for Flip-Chip Solder Interconnects Using RAPID Mechanical Cycling Method.  Marbut, C., Montazeri, M., & Huitink, D.
Thrust 3 2016 An Analytical Method for Evaluating the Power Density of Multilevel Converters.  Modeer, T., Barth, C., Lei, Y., & Pilawa-Podgurski, R.
Thrust 3 2019 Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test.  Montazeri, M., Marbut, C. J., & Huitink, D.
Thrust 3 2019 Understanding the switching mechanism of interfacial phase change memory.  Okabe, K. L., Sood, A., Yalon, E., Neumann, C. M., Asheghi, M., Pop, E., … Wong, H.-S. P.
Thrust 3 2019 Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis.  Pense, D., Carlton, H., & Huitink, D.
Thrust 3 2017 Effect of well/barrier thickness ratio on strain relaxation in GaN/AlN superlattices grown on GaN/sapphire template, Salamo, Greg J.
Thrust 3 2018 Asymmetrical reciprocal space mapping using X-ray diffraction: a technique for structural characterization of GaN/AlN superlattices, Salamo, Greg J.
Thrust 3 2018 Optical and structural study of deformation states in the GaN/AlN superlattices, Salamo, Greg J.
Thrust 3 2019 Process-induced anomalous current transport in graphene/InAlN/GaN heterostructured diodes.  Satterthwaite, P. F., Yalamarthy, A. S., Vaziri, S., Rojo, M. M., Pop, E., & Senesky, D. G.
Thrust 3 2016 The Design and Evaluation of an Integrated Wire Bond-less Power Module using a Low Temperature Co-fired Ceramic Interposer. Seal, S., Glover, M. D., & Mantooth, H. A.
Thrust 3 2016 Flip-Chip Bonded Silicon Carbide MOSFETs as a Low Parasitic Alternative to Wire-Bonding.  Seal, S., Glover, M. D., Wallace, A. K., & Mantooth, H. A.
Thrust 3 2016 X-ray Reciprocal Space Mapping of Graded Al x Ga1 − x N Films and Nanowires. Stanchu, H. V., Kuchuk, A. V., Kladko, V. P., Ware, M. E., Mazur, Y. I., Zytkiewicz, Z. R., . . . Salamo, G. J.
Thrust 3 2016 DC characteristics of ALD-grown Al 2 O 3 /AlGaN/GaN MIS-HEMTs and HEMTs at 600 °C in air. Suria, A. J., Yalamarthy, A. S., So, H., & Senesky, D. G.
Thrust 3 2019 Analysis of heater-wall temperature distributions during the saturated pool boiling of water.  Voglar, J., Zupančič, M., Peperko, A., Birbarah, P., Miljkovic, N., & Golobič, I.
Thrust 3 2016 Water Droplet Impact on Elastic Superhydrophobic Surfaces.  Weisensee, P. B., Tian, J., Miljkovic, N., & King, W. P.
Thrust 3 2017 Springboard Droplet Bouncing on Flexible Superhydrophobic Substrates. Weisensee, P. B., Tian, J., Miljkovic, N., & King, W. P.
Thrust 3 2019 Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics.  Whitt, R., Nafis, B., Huitink, D., Yuan, Z., Deshpande, A., Narayanasamy, B., & Luo, F.
Thrust 3 2019 Thermal Validations Of Additive Manufactured Non-Metallic Heat Spreading Device For Hot Spot Mitigation In Power Modules.  Whitt, R., & Huitink, D.
Thrust 3 2018 Millimeter-scale liquid metal droplet thermal switch.  Yang, T., Kwon, B., Weisensee, P. B., Kang, J. G., Li, X., Braun, P., . . . King, W. P.
Thrust 3 2019 An Integrated Liquid Metal Thermal Switch for Active Thermal Management of Electronics.  Yang, T., Foulkes, T., Kwon, B., Kang, J. G., Braun, P. V., King, W. P., & Miljkovic, N.
Thrust 3 2019 Design and Evaluation of A 150 kVA SiC MOSFET Based Three Level TNPC Phase-leg PEBB for Aircraft Motor Driving Application. Yuan, Z., Deshpande, A., Narayanasamy, B., Peng, H., Emon, A. I., Whitt, R., … Huitink, D.
Thrust 3 2018 Enhanced Capillary-Fed Boiling in Copper Inverse Opals via Template Sintering.  Zhang, C., Palko, J. W., Barako, M. T., Asheghi, M., Santiago, J. G., & Goodson, K. E.
Thrust 3 2018 Tailoring Permeability of Microporous Copper Structures through Template Sintering.  ​Zhang, C., Palko, J. W., Rong, G., Pringle, K. S., Barako, M. T., Dusseault, T. J., . . . Goodson, K. E.
Thrust 3 2019 Lithiation Induced Stress Concentration for 3D Metal Scaffold Structured Silicon Anodes. Zheng, Z., Chen, B., Fritz, N., Gurumukhi, Y., Cook, J., Ates, M. N., … Wang, P.